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Asus ROG G703 will use patent pending liquid metal thermal paste process, promises 13 C cooler temperatures

Started by Redaktion, May 29, 2019, 08:29:43

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Redaktion

Asus is ready to ship laptops with liquid metal thermal paste and the initial results have us excited. The cooler temperatures will lead directly to quieter, lighter, or thinner laptop designs from future ROG laptops.

https://www.notebookcheck.net/Asus-ROG-G703-will-use-patent-pending-liquid-metal-thermal-paste-process-promises-13-C-cooler-temperatures.422700.0.html

S.Yu

This would only work if the bottleneck of the cooling system is the interface, not the fan power right?

J

The brand is Thermal Grizzly. Conductonaut is the exact liquid metal being used. its even on the packaging. How did this make it past NBC's proof reading

Allen.Ngo

Quote from: J on May 29, 2019, 16:06:35
The brand is Thermal Grizzly. Conductonaut is the exact liquid metal being used. its even on the packaging. How did this make it past NBC's proof reading

Our apologies, thank you for the correction :)

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