Samsung's HBM3E chips overcome heat and power hurdles to secure Nvidia's approval

[Redaktion]

Samsung Electronics has passed Nvidia's rigorous testing for its 8-layer HBM3E memory chips. This achievement will push Samsung ahead in the rapidly growing HBM (high-bandwidth memory) market, where AI applications are fueling demand. Overcoming previous challenges related to heat and power consumption, Samsung's latest HBM3E chips are likely to compete with rival SK hynix.

https://www.notebookcheck.net/Samsung-s-HBM3E-chips-overcome-heat-and-power-hurdles-to-secure-Nvidia-s-approval.872481.0.html