TSMC announces revival of glass substrate R&D, challenging Intel's lead in advanced packaging tech

[Redaktion]

Semiconductor giants like Intel and TSMC are pushing the boundaries of Moore's Law by advancing glass substrate tech. Despite challenges, Intel is targeting mass production by 2026, while TSMC - under pressure from NVIDIA - has announced the revival of its glass substrate R&D to keep up with competition.

https://www.notebookcheck.net/TSMC-announces-revival-of-glass-substrate-R-D-challenging-Intel-s-lead-in-advanced-packaging-tech.881519.0.html