Quote from: Mark P on April 10, 2020, 19:03:37
Is this Intel's fault for not giving OEMs sufficient data in the lead-up to release? Will this no longer be a problem when passively cooled Apple-designed ARM chips take over in the Air? I hope so.
Even then it's still not a valid excuse, especially for the 16" inch version where every one already knows how much power intel 14nm would use.
It's not even for the 13" mba. You could handle the old 28w 4c8t 14nm in 13" mbpr before, but now you could not handle 10nm Y series?
Yes, heat is more concentrated when you shrink the lithography, but checkout how zen 2 with 7nm is handled well in Asus G14. They are all brand new products that didn't exists before, and Asus nailed it while Apple didn't, that's all. You may argue that it's a lot of heatpipes in G14 and mba are supposed to be light machine so they can't really play similar tricks, but I would say enough of this endless thin and light game. No one really benefits from that extra 200 grams you save, except Apple, who could advertise them and attract more people that don't really know what they need. Someone have to stop this. Besides, G14 is not heavy, even light, if you consider how much power is packed into it.