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MIT and Stanford present a 3-D chip that integrates CPU and RAM

Started by Redaktion, July 11, 2017, 14:09:54

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Redaktion

July 11, 2017, 14:09:54
The 3-D chip built by MIT/Stanford uses carbon nanotubes to interconnect stacked-up logic layers and RAM layers.

https://www.notebookcheck.net/MIT-and-Stanford-present-a-3-D-chip-that-integrates-CPU-and-RAM.232822.0.html
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