Infineon debuts the world’s thinnest silicon wafers at 20 micrometers thick

[Redaktion]

Infineon Technologies AG pioneers ultra-thin 300mm silicon power wafers at just 20 micrometers, setting a new industry standard. This breakthrough cuts substrate resistance by half and power loss by over 15 percent, significantly boosting performance and efficiency.

https://www.notebookcheck.net/Infineon-debuts-the-world-s-thinnest-silicon-wafers-at-20-micrometers-thick.911595.0.html