The Y series chips (what these would historically be used as) have always had smaller packages. Admittedly, it was originally developed several generations ago for Apple (during the Core Duo days, for the original MBA, iirc).
There is a downside, usually. Fewer PCIe lanes, no dGPU compatibility (Intel explicitly lists that, I don't really know what the actual implications are - eGPUs seem to work, so maybe it's a restriction on OEMs only), and I would venture a slower DMI link (though that spread to the larger packages, too, as an OEM configurable option). Though the latter doesn't matter as much anymore, since the TB3 controllers for Ice Lake are on the CPU die, and don't suffer the DMI bottleneck. Now, only the SSD, WiFi, and RJ45 (Ha! As if) share the DMI link.
Quote from: _MT_ on March 23, 2020, 10:34:02
You say not all CPU options were disclosed. AFAIK, there were three options. So, I'm now confused. How many options are there going to be? It still looks like three and with the same parameters.
It looks to me like these might be custom units for Apple. I guess Apple wanted a smaller package. And they removed (some of) what Apple doesn't use. There are plenty of laptops that are SSD-only but I still have hard time imagining Intel ditching Optane support in a processor for wider audience. And AFAIK, Apple doesn't use TXT either.