NotebookCHECK - Notebook Forum
English => News => Topic started by: Redaktion on September 19, 2023, 18:23:35
Intel's glass substrate technology for next-generation advanced packaging is planned to make its debut in the second half of this decade. The breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore's Law to deliver faster AI, HPC and graphics applications.https://www.notebookcheck.net/Intel-announces-glass-substrate-packaging-for-future-processors-aims-for-1-trillion-transistors-per-chip-by-2030.752617.0.html