An insider's look at how Intel managed to position itself in a very delicate situation over the past decade. The obsession for transistor densities and the stubborn pursuit to implement the challenging GAAFet manufacturing process seem to be the main reasons why Intel is still mostly stuck on the 14 nm node. Is Intel accepting defeat and can TSMC really help in the coming years?
https://www.notebookcheck.net/Intel-ex-employee-reveals-insider-details-on-company-policies-up-to-the-7-nm-delays.484353.0.html
Key question Bob needs to ask is what has been common for TMG in 10nm and 7nm delays. There were two common factors :
1) TD yield department was (and still is!!) headed by an inexperienced VP who mismanaged his org and caused heavy attrition of talent and experience and promoted weak non performers to managerial positions.
2) SVP heading overall TD (Chinese exec Peng) turned a blind eye to the above and also allowed Sohail's cronies to persist and thrive in TD long after Sohail was gone (of which there are many). Kaizad has had relatively less power compared to Peng who was promoted by Sohail to lead the whole of TD.
Talented people and a positive environment with reasonable goals would have made Intel more successful. This density mantra sounds like a a cost saving measure that contributed to significant loss if revenue and reputation.
Maybe Intel needs a big acquisition to turn everything around, it's easier than facing the truth of poor management and lack of investment in people and culture.
Thanks for this in-depth research.
They hired an AMD architect soon after Ryzen release... what was that about and what has come of it?