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Occupy less foot print?  How come it looks way bigger than SO-DIMM? The reason M.2 is more popular than 2.5 inch is because of its much smaller foot print.  I will expect SO-DIMM to evolve instead using this giant piece of CAMM.

In fact, vile capitalist b******s just realized that memory is very cheap and these freaks can't do anything about it, as well as an independent memory upgrade by buyers many times cheaper than greedy and greedy manufacturers are trying to sell.

And now, under the guise of "innovation" they can sell new s*** at exorbitant prices. And what's even worse for consumers is that they lose the ability to move old memory to new systems.

Everything is obvious - vile capitalism in the current imperialistic-consumer model has become fetters and chains on the feet of the progressive part of humanity. And every time it gets worse and worse...

Useful properties of globalization are deliberately destroyed (positive communications and fast unions for people and thoughts), and vile manifestations are cultivated - common concentration camp
"standards" and tracking people globally.

This seems more like a solution in search of a problem.  This is going to add a lot of costs.  Let's break it down:

1. New, bigger, more complex connector: adds cost and weight.
2. Bigger carrier board for memory modules: adds cost and weight.
3. Needs screws where before they used latches: Some material cost added and some weight, but worse: a bunch of assembly cost added.
4. Overall heavier than SO-DIMMS, so that weight increase will flow thru the supply chain, incrementally raising prices.
5. New connectors will have higher defect rates and will throw away decades of high-scale manufacturing cost reduction that was put into SO-DIMM.

If there is any possible way to add more lanes or better lanes to a SO-DIMM or similar connector format, especially if it is backward compatible, that would be a huge win over this big, expensive thing.

I don't buy the "thinner" argument.  If you want thin, solder the chips on.  Everyone who wants thin pretty much accepts that they won't get memory upgrades.

if will be a Dell technology only, gonna be a failure, as it has been the old rambus on their old Precision workstations.
Maybe can be more powerful and faster than the currents ddr, but if they will not be adopted by other manufactured will be relegated only to a small niche, and will ended up to be abandoned.

Everywhere in this article says this memory module has 128 GB, but it's clearly visible written on the memory module itself, it's in fact a 32 GB module. Your own review of the Dell Precision 7670 says this same module is 32 GB. Please fix this article.

If I see this out in production, I'm absolutely picking a product with sodimms over this.  While I appreciate the removable LGA aspect of the design, every other major feature is a downgrade from the current standard.  The arguments about traces and form factor issues are moot as they're easily solved on any boards that have been properly designed.  If anything, we should be seeing more inline edge connectors for sodimms instead of mounting them on top of the board. 

Unless it's standardised this will die.
It strikes cynical me as a measure for them to deny RAM upgrade capability whilst allowing multiple mainboards to be used.

Of course, it's entirely possible that the industry will decide to simply solder the RAM, even in large workstations. It seems that some people at Dell believe in modularity, at least for certain models. They demonstrated it before with GPUs. And since there are no readily available standards, they roll their own.

Quote from: Dom Pedro II on September 30, 2022, 22:07:12We've passed the point where thickness matters years ago. There's nothing to gain from making laptops even as thin as some are with SODIMMs

You or I might think so but that doesn't change the fact that manufacturers believe that consumers want thin laptops. The disadvantage of soldered RAM, from manufacturer's standpoint, is that every CPU-memory combination requires a separate motherboard which complicates logistics. CAMM could give them modularity without giving too much leeway to end users (cheap upgrades). Also, if SODIMM really has a hard bandwidth limit, its only a matter of time before it gets obsolete, at least at the higher end. Without a successor, the memory would have to be soldered on all high-end machines.

In terms of thickness it doesn't seem to be a huge win when compared to a single SODIMM slot as seen in Zephyrus g14. And upgrade path is a bit blurry, does this Precision laptop need a bracket to support a smaller CAMM?

I like the idea of camm.
Yes the module was large, but it was also 128gb, something few people would need and the same as 4 32 gb sodimm modules.
I wouldn't be surprised if there are two sizes, half size and full size so that smaller laptops could use smaller modules. Kind of like atx and itx desktop motherboards.

As working for 25 years in this industry, it´s easy to know that if the standard is not open, also, Dell price for their memories were always expensive. This project will die. Don´t think that this move will work and think that the users are stupid enough to use an close standard.

Ultra thin laptops are all surface mount, they're low power and want all the speed they can get for the wattage. Direct surface mount gives you that because of the less EMI and latency. Companies like Apple and Microsoft love this. They don't want you to upgrade. Large companies love planned obsolescence. Microsoft gave the excuse it's because people can Liquid Nitrogen the ram modules then copy the data while in sleep mode. While true how many people are going to do that exactly?
SODIMM is mostly used in Gaming and Mobile Workstations. Where thickness of the laptop doesn't matter at all. With so much horse power that the speed of the system is completely reliant on the thermal solutions used. Even then a lot of companies put lower speed half density one sided SODIMM modules anyways to slow the system down so they meet battery time targets for the laptop anyways.
Because in today's systems being so limited by thermals SODIMM has always been the last thing on laptop makers minds. The ram speed hasn't been the limiting factor. With AMD and Intel doing full bore on thermals now it's probably not going to change anytime soon.
This is like when Intel's thunderbolt was largely rejected when it came out. Wasn't open standard and had large royalties and was brand locked to Intel. While USB4 is planned to replace it now.
Most consumer laptops have small margens, paying royalties for something else at this point would only make sense on business line laptops which are usually way overpriced.

If they don't make it an open standard for everyone else to use it is DOA!