Quote from: h4 on March 21, 2023, 05:10:11The Intel 20A and TSMC N3/N3E have very different design rules, so it is doubtful that the CPU tiles will be manufactured at TSMC (if it will be launched a year later, the design must have been completed a year ago and on-silicon verification already completed at N3). GPU tile may not move to N3 either, but more likely N5.

One more thing, this story is based on the following assumptions
8+16 segments (desktop i7/9 & laptop HX)
6+8 segments (desktop i3/5 & laptop H/P, possibly ARL, where 15W is also 4+8)
2+8 segments (desktop i3 & laptop U/9W)
The 9W segment is skipped in RPL. I guess they are saying something similar to this will happen.

The TSMC N3B node is rather a bit of a joke by all reports. It is described as one of the weakest node updates in history and given its extortionate price, only a fool would use it. Apparently many customers are choosing to wait for N3E. At this stage N4P is a far better choice for companies

Intel has already embarrassed TSMC's late 2022 and 2023 reserve by canceling it. So it's not the first time for them to arrange long-term construction.

In any case, "6"-"10"nm is already dead today, as technologies for processors and gpu.

The Intel 20A and TSMC N3/N3E have very different design rules, so it is doubtful that the CPU tiles will be manufactured at TSMC (if it will be launched a year later, the design must have been completed a year ago and on-silicon verification already completed at N3). GPU tile may not move to N3 either, but more likely N5.

One more thing, this story is based on the following assumptions
8+16 segments (desktop i7/9 & laptop HX)
6+8 segments (desktop i3/5 & laptop H/P, possibly ARL, where 15W is also 4+8)
2+8 segments (desktop i3 & laptop U/9W)
The 9W segment is skipped in RPL. I guess they are saying something similar to this will happen.