at that price it should ilnclude 10G ethernet as standard.

I'm not agree, with that chassis of actual macmini with M1X/M2 could use top/bottom design for a double ventilation, seeing on WccfTech/Anandtech the M1 get better perfs in macmini in comparison of other apple products, this because get a good ventilation having 30 °C T, with 3D packaging could be the first tech company to introduce double top/bottom ventilation to mantain low temperatures for higher perfs, even for future processors like M3/M4 and a larger die.

Quote from: WF Posey on May 23, 2021, 11:04:07
Nonsense. Apple's obsession with "thin" is perverse, an absurd fetish that masks the empty soul of it's developers, plastic, shallow anglo men with no life and no understanding, at any level, of what human beings need a computer for. I call BS.

I would agree in laptops but the fact is that chassis of the Mac mini was designed for Intel processors with significantly larger TDP envelope and lower integration, requiring more board space. When you look into the M1 version, there is a ton of wasted space. And Mac mini is not exactly the smallest mini PC on the market. As long as they don't go overboard where it would become noisy (and as long as PSU stays inside the unit), why not. I've got a much bigger problem with the new iMac or the rumoured MBA.

Nonsense. Apple's obsession with "thin" is perverse, an absurd fetish that masks the empty soul of it's developers, plastic, shallow anglo men with no life and no understanding, at any level, of what human beings need a computer for. I call BS.

16 is fine, like GTX 1060 6G, 32 will be expensive and is a next generation ready for 2023